Our Capabilities - flex circuits
Description
Production
Prototype
R&D
Number of Layers
1 to 14
14 to 18
over 18
Trace Width - 0.5 oz. copper
3 mils and above
up to 2.5 mils
below 2 mils
Trace Width - 1.0 oz. copper
6 mils and above
up to 4 mils
3 mils
Smallest Hole Size - mech. drilled
8 mils
6 mils
N/A
Smallest Hole Size - laser drilled
4 to 6 mils
up to 3 mils
2 mil
Aspect Ratio - PTH
6:1 max.
up to 10:1
over 10:1
Aspect Ratio - blind microvia
1:1 max.
up to 1.5:1
over 1:1
Minimum Pad Size - internal layer
DHS + 16 mils
DHS + 12 mils
DHS + 10 mils
Minimum Antipad Size
DHS + 28 mils
DHS + 20 mils
DHS + 15 mils
Minimum Pad Size - button plating
DHS + 20 mils
DHS + 14 mils
DHS + 12 mils
Minimum Pad Size - pattern plating
DHS + 14 mils
DHS + 12 mils
DHS + 10 mils
Minimum Soldermask Clearance
4 mils per side
3 mils per side
2 mils per size
Minimum Soldermask Webbing
8 mils
6 mils
4 mils
Minimum Coverfilm Webbing
12 mils
10 mils
8 mils
Allowable Squeezeout per Side
4 mils/mil
3 mils/mil
2 mils/mil
Impedance Control Tolerance
+/- 15%
+/- 10%
+/- 5%
Leadtime - 1 to 2 layers
3 weeks
1 to 5 days
Call
Leadtime - 3 to 8 layers
4 weeks
4 to 10 days
Call
Leadtime - 8 to 14 layers
4 to 5 weeks
8 days minimum
N/A
Leadtime - 15 to 18 layers
N/A
15 days minimum
N/A
Note: DHS (drilled hole size) is typically larger than FHS (finished hole size) by 5 mils for component holes. For vias DHS can be the same size as FHS.