FIT FAQs
| Frequently Asked Questions |
| 1. What type of formats can you accept? |
| • | Gerber (RS274-D) with Aperture file |
| • | Gerber extended ( RS274-X). This is preferred. |
| • | DXF (1:1 scale) |
| • | AutoCAD DWG (1:1 scale) |
| • | HPGL (for fab drawings only) |
| 2. What information do you need to Quote flex circuit fabrication? |
| • | Part Dimension (X and Y) |
| • | Number of layers |
| • | Materials, construction and type of flex circuit (Rigid-flex, Multilayer, etc.) |
| • | Surface Finish |
| • | Any special process requirements such as microvias, laser skiving, traces below 75 micron, tight tolerance (less than +/- 0.002"), copper alloys, etc. |
| • | Any control impedance requirements |
| • | Minimum hole size and pad size |
| • | Minimum trace and space |
| • | Quantity |
| • | Lead-time |
| • | Gerbers and fab prints are preferred to perform a thorough design review prior to quoting, as well as figuring out the best way to fit the part on a panel. |
| 3. What do you need for manufacturing my flex circuits? |
| • | Gerber files |
| • | NC Drill file (preferably in Excellon format) |
| • | Fab Drawing (which includes board dimensions, material call out / construction, notes for specification and hole schedule) |
| 4. What do you need for assembly of flex circuits? |
| • | Bill of Materials |
| • | Assembly Drawing |
| • | Assembly Data sheet for components such as BGAs |
| • | Complete Kit for consigned orders |
| 5. Can you calculate and build Impedance Controlled flex circuits? |
| • | We can model impedance values for microstrip, coated microstrip, stripline, asymmetric stripline and differential pair. We can build a test coupon for TDR testing upon customer's request. We will build boards to your specifications for impedance control and double check your build with our software. |
| 6. What do you need to layout Flex Circuit Design? |
| • | Schematics |
| • | Netlist |
| • | Mechanical Drawing or Board Outline |
| • | BOM and applicable parts list (including data sheets if available) |
| • | Special requirements such Controlled Impedance, Shielding, Flexing cycles, Environmental requirements, etc. |
| • | Pad pattern for any wire bond area |
| • | Parts placement specification |