1603 Watson Court
Milpitas, CA 95035

Tel: (408) 635-3540
Fax: (408) 956-8278

sales@fit4flex.com
FIT FAQs
| Frequently Asked Questions |
|
| 1. What type of formats can you accept? |
|
| |
Gerber (RS274-D) with Aperture file |
|
|
| |
Gerber extended ( RS274-X). This is preferred. |
|
|
| |
AutoCAD DWG (1:1 scale) |
|
|
| |
HPGL (for fab drawings only) |
|
|
| 2. What information do you need to Quote flex circuit fabrication? |
|
| |
Part Dimension (X and Y) |
|
|
| |
Materials, construction and type of flex circuit (Rigid-flex, Multilayer, etc.) |
|
|
| |
Any special process requirements such as microvias, laser skiving, traces below 75 micron, tight tolerance (less than +/- 0.002"), copper alloys, etc. |
|
|
| |
Any control impedance requirements |
|
|
| |
Minimum hole size and pad size |
|
|
| |
Minimum trace and space |
|
|
| |
Gerbers and fab prints are preferred to perform a thorough design review prior to quoting, as well as figuring out the best way to fit the part on a panel. |
|
|
| 3. What do you need for manufacturing my flex circuits? |
|
| |
NC Drill file (preferably in Excellon format) |
|
|
| |
Fab Drawing (which includes board dimensions, material call out / construction, notes for specification and hole schedule) |
|
|
| 4. What do you need for assembly of flex circuits? |
|
| |
Assembly Data sheet for components such as BGAs |
|
|
| |
Complete Kit for consigned orders |
|
|
| 5. Can you calculate and build Impedance Controlled flex circuits? |
|
| |
We can model impedance values for microstrip, coated microstrip, stripline, asymmetric stripline and differential pair. We can build a test coupon for TDR testing upon customer's request. We will build boards to your specifications for impedance control and double check your build with our software. |
|
|
| 6. What do you need to layout Flex Circuit Design? |
|
| |
Mechanical Drawing or Board Outline |
|
|
| |
BOM and applicable parts list (including data sheets if available) |
|
|
| |
Special requirements such Controlled Impedance, Shielding, Flexing cycles, Environmental requirements, etc. |
|
|
| |
Pad pattern for any wire bond area |
|
|
| |
Parts placement specification |
|
|