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FIT NEWS

Flex Interconnect Technologies Reports Growth in Challenging Year 2009

January 6, 2010 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that its annual revenue grew by 6% even in the challenging 2009 year. In addition, the company added employees in 2009 growing by 11%, as well as invested in capital equipment to support customer requirements and stay ahead on the technology roadmap.

FIT has been recognized as one of the top-50 fastest growing privately held companies in the Silicon Valley for three years. Company revenues have continuously grown 10 out of its 11 year history at aggregate growth rate of 41.5%. FIT’s growth is driven by its commitment to providing unique value added solutions to its customers with certified quality and on-time delivery.

Flex Interconnect Technologies Announces Collaboration with Electronic Interconnect

November 30, 2009 – Electronic Interconnect (EI), a leading solutions provider for all aspects of flexible printed circuitry, announced a cooperative agreement with Electronic Interconnect (EI) to jointly provide a wider range of PCB products to their customers. EI specializes primarily in rigid PCB types, while FIT is a leader in providing complete end-to-end flexible circuits, Rigid-flex and HDI flex solutions, from design and manufacturing to final assembly.

In making the announcement, Pratish Patel, EI President and CEO, said, "This cooperation between EI and FIT directly benefits our customers by offering a wider range of PCB technologies from our individual specializations. FIT is a recognized leader in flex and rigid-flex boards, and we specialize in rigid PCBs for leading-edge applications, such as products requiring thermal management and specialized materials and designs. By bringing our talents together, we can now offer the customer an unsurpassed range of technical expertise in advanced PCB technology."

Raj Badoni Named FIT's New Director of Sales and Marketing

March 11, 2009 – Flex Interconnect Technologies (FIT), a leading solutions provider for all aspects of flexible printed circuitry, announced today that Raj Badoni has been named its new Director of Sales and Marketing.

“Raj’s extensive background in the semiconductor industry, and blend of technical and business management experience will be instrumental in strengthening our existing customer relationships, and developing new ones,” said Chetan Shah, FIT’s Co-founder and President.

Flex Interconnect Receives ITAR Registration

October 21, 2008 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that they have received official International Traffic in Arms Regulations (ITAR) registration from the US Department of State. The registration recognizes Flex Interconnect Technologies’ adherence and commitment to the regulations that control the export and import of defense related articles and services.  ITAR compliance ensures that Flex Interconnect Technologies has the capabilities, expertise  and regulatory oversight to properly handle the manufacturing of Military, Defense and Aerospace technology.

Flex Interconnect Technologies Receives AS9100 Certification

March 18, 2008 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that its Quality Management System is certified to AS9100 revision B standards. The AS9100 revision B is a standard developed by International Aerospace Quality Group (IAQC).

The certification of Flex Interconnect Technologies was granted after intense audit by Intertek Systems, one of the most reputed Registrars of Aerospace standards. Flex Interconnect Technologies passed the audit with a perfect 100% score.

Flex Interconnect Technologies Relocates to New Facility

March 1, 2004 - Flex Interconnect Technologies (FIT), Inc. has expanded to a new 15,000 sf facility. This state of the art facility will support the growing customer base and strategic partners. 

Dean Matsuo, Vice President stated, "Flex Interconnect has been growing on an average 60% per year over the last 5 years. The new facility and equipment as well as new hires will help us increase our capacity three-fold. It will also allow us to support the quickturn prototype as well as production needs of our customers."

Flex Interconnect Technologies Partners with Samtec

February 18, 2004 - Flex Interconnect Technologies (FIT), Inc. has been selected by Samtec to support their customers needs for prototype and pre-preproduction quantities of flex and rigid-flex circuits.

Chetan Shah, President stated, "We are proud of our strategic alliance with Samtec to support their customers' quickturn prototype requirements for on-time quality flex circuits." 

Chetan Shah, President stated, "Network Electronics Marketing bring years of experience, technical knowledge and unsurpassed devotion to customer service that harmonizes with the philosophy of FIT to provide total customer satisfaction."