| Frequently Asked Questions |
| 1. What type of formats can you accept? |
| Gerber (RS274-D) with Aperture file | |
| Gerber extended ( RS274-X). This is preferred. | |
| DXF (1:1 scale) | |
| AutoCAD DWG (1:1 scale) | |
| HPGL (for fab drawings only) | |
| 2. What information do you need to Quote flex circuit fabrication? |
| Part Dimension (X and Y) | |
| Number of layers | |
| Materials, construction and type of flex circuit (Rigid-flex, Multilayer, etc.) | |
| Surface Finish | |
| Any special process requirements such as microvias, laser skiving, traces below 75 micron, tight tolerance (less than +/- 0.002"), copper alloys, etc. | |
| Any control impedance requirements | |
| Minimum hole size and pad size | |
| Minimum trace and space | |
| Quantity | |
| Lead-time | |
| Gerbers and fab prints are preferred to perform a thorough design review prior to quoting, as well as figuring out the best way to fit the part on a panel. | |
| 3. What do you need for manufacturing my flex circuits? |
| Gerber files | |
| NC Drill file (preferably in Excellon format) | |
| Fab Drawing (which includes board dimensions, material call out / construction, notes for specification and hole schedule) | |
| 4. What do you need for assembly of flex circuits? |
| Bill of Materials | |
| Assembly Drawing | |
| Assembly Data sheet for components such as BGAs | |
| Complete Kit for consigned orders | |
| 5. Can you calculate and build Impedance Controlled flex circuits? |
| We can model impedance values for microstrip, coated microstrip, stripline, asymmetric stripline and differential pair. We can build a test coupon for TDR testing upon customer's request. We will build boards to your specifications for impedance control and double check your build with our software. | |
| 6. What do you need to layout Flex Circuit Design? |
| Schematics | |
| Netlist | |
| Mechanical Drawing or Board Outline | |
| BOM and applicable parts list (including data sheets if available) | |
| Special requirements such Controlled Impedance, Shielding, Flexing cycles, Environmental requirements, etc. | |
| Pad pattern for any wire bond area | |
| Parts placement specification | |