Flex Circuit Fabrication
We’ve been perfecting flex and rigid-flex manufacturing for over 25 years. Many of our employees have been with us for over 15 years. We have some of the most experienced engineers, operators, technicians, and managers specialized in manufacturing flexible circuits.
Our In-House Specialities:
- Flexible printed circuits
- Flexible printed circuits with sitffeners
- Rigid-flex circuits
- Heater-flex circuits
We can deliver your flex circuits in the following variations:
- Laser routed into individual boards
- In an array with tab rout, rails, fiducials and tooling holes. An FR4 backer may be added for stability depending on the assembly requirements
- Partially or fully loaded populated circuits so all you have to do is plug and play
| MANUFACTURING CAPABILITIES |
||
| Specifications | Standard | Advanced |
| Min Trace/Space | 75 microns | 50 microns |
| Smallest Mechanical Drill | 0.150 mm | 0.100 mm |
| Smallest Laser Drill | 0.075 mm | 0.050 mm |
| Max Aspect Ratio | 8:01 | 10:01 |
| Max Blind Via Aspect Ratio | 0.7:1 | 1:01 |
| Min Internal Pad Size | DHS + 0.350 mm | DHS + 0.200 mm |
| Min Clearance Pad Size | DHS + 0.600 mm | DHS + 0.400 mm |
| Min External Pad Size | DHS + 0.250 mm | DHS + 0.200 mm |
| Min Pad Size for Selective Plating | DHS + 0.450 mm | DHS + 0.400 mm |
| Min Soldermask Clearance | 0.075 mm per side | 0.050 mm per side |
| Min Soldermask Webbing | 0.150 mm | 0.100 mm |
| Min Mask Defined Pad Diameter | 0.125 mm | 0.100 mm |
| Min Coverlay Clearance | 0.200 mm per side | 0.125 mm per side |
| Min Feature-to-Board Edge | 0.250 mm | 0.075 mm |
| Number of Layers | 1 to 24 | Up to 30 |
| HDI Capabilities | Yes | Sintering Paste Technology |
| Max Flex Length | 57.15 cm | Greater than 58 cm |
| Via Fill Capability | Yes | Yes |
| Max Board Thickness | 2.4 mm | 3.10 mm |
| Min Copper Weight | 9 to 18 micron | 0.4 to 5 micron |
| Max Copper Weight | 3 oz. | 4 oz. |
| Shielding Method | Copper, Tatsuta, Silver Ink | Copper, Tatsuta, Silver Ink |
| Impedance Tolerance | +/- 10% | +/-5% |
| Assembly | BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201 | Flying Probe, Functional, JTAG, ICT |
| Testing | Flying Probe, Functional, JTAG, ICT | Yes |
| Conformal Coating | Yes | |
| Surface Finish | ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL |
|
| Panel Size | 9 x 12", 12 x 12", 12 x 18", 12 x 24" | |